Hybrid metal–polymer additive manufacturing for direct 3D printing of functional electronic devices and smart components.
HEM Dimensions develops a proprietary hybrid additive manufacturing system that combines molten metal droplet deposition with polymer 3D printing to directly fabricate functional electronic devices and smart components. By integrating electrical and mechanical features within a single manufacturing workflow, the technology enables faster prototyping, compact device architectures, and design capabilities not achievable with conventional PCB-based manufacturing and assembly.
HEM Dimensions has received support through Boeing BUILD 2.0, Honeywell, EXIM Bank, and NIDHI–PRAYAS, and is incubated under FSID-IISc. The company has also benefited from competitive R&D programs and grants both within and outside the IISc ecosystem. It is now preparing for formal fundraising and exploring suitable deep-tech grant opportunities.
We hold one granted international patent titled "System and method for generating molten metal droplets for additive manufacturing," granted in India, with corresponding applications filed in Europe (EPO), Japan, USA, and China, along with additional IP under development in hybrid metal-polymer additive manufacturing.
The organization has received recognition, including the Boeing Build 2.0 (Winner), Honeywell CSR Grant, Nidhi-Prayas Grant, National Robotics Competition (First Prize), DRDO Best Paper Award, and AYEL–IFCI National Entrepreneurship Award. They have been featured in IISC Connect Magazine and showcased at events such as Aero India, G20 Digital Innovation Alliance, and the CMTI Robotics Summit.
Led by Dr. Hemang Kumar Jayant (Founder & CEO, IISC Bangalore expert in Hybrid Additive Manufacturing and Smart Manufacturing) and Pallavi Jayant (Operations and Strategy), the team is supported by experienced engineers and researchers from IISC's design and manufacturing ecosystem.
Chief Executive Officer
Growth & Marketing Head
